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W9751G6IB
11. PACKAGE SPECIFICATION
Package Outline WBGA-84 (10x12.5 mm 2 )
eE
E1
PIN A1 INDEX
A1
A
bbb
C
PIN A1 INDEX
E
aaa
B
C 4X
9
8
7
3
2
1
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
84x ψ b
THE WINDOW-SIDE
ENCAPSULANT
ccc C
C
SEATING PLANE
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
SYMBOL
DIMENSION (MM)
MIN. NOM. MAX.
Ball Land
A
A1
b
D
E
D1
E1
---
0.25
0.40
12.40
9.90
---
---
---
12.50
10.00
11.20 BSC.
6.40 BSC.
1.20
0.40
0.50
12.60
10.10
Ball Opening
eE
eD
aaa
bbb
ccc
---
---
---
0.80 BSC.
0.80 BSC.
---
---
---
0.15
0.20
0.10
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested
0.4mm
Publication Release Date: Oct. 23, 2009
- 85 -
Revision A06
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